PIC-based components for 5G

USE
CASE

1

  • Active and passive component measurement
  • Characterization of thousands of components per wafer  
  • Multivendor and complex test stations
  • Testing at different stages: wafer level, die level, packaging, quality assurance

Challenge

Circuit component, Rectangle

OSA20 & CTP10

  • Active and passive optical component testing
  • Swept optical testing provides fast acquisition with picometer resolution and accuracy
  • Full remote control via SCPI commands
  • Wafer-level and final testing after packaging

Solution

  • OSA20 for transceiver testing: measurement of key parameters such as central wavelength, SMSR and OSNR
  • CTP10 for passive component testing: IL, RL, PDL , incl. AWG or ring resonators in less than 5 sec.
  • High dynamic range measurement in a single scan, ensuring fast and reliable results
  • Proven integrations with several probe station manufacturers
  • Consistent measurements using the same test instruments throughout all the manufacturing stages

Results

CTP10 analysis results